Introduction to double-sided PCB circuit board manufacturing process

The double-sided PCB circuit board manufacturing process mainly includes the following steps:

Prepare the double-sided copper board: lay the two copper boards together, bond them, and then drill holes into them along the X and Y directions respectively.

Conduct conductive layer production: the surface of the copper board coated with photosensitive film, and then in accordance with the requirements of the circuit diagram exposure, and then wash, so that the photosensitive film remains only in the copper board the desired part of the circuit graphics.

Etching: the photosensitive film after exposure of the copper plate into the etching machine for etching, etching the unwanted parts, the formation of the conductive layer of the circuit board.

Make a gum yellow map: The conductive layer is coated with UV-hardened paint, and after UV irradiation, the paint is removed from the unirradiated portion using a gum yellow map to form a gum yellow map (graphic layer).

Plating a layer of copper on both sides of the circuit board: The conductive layer of the circuit board is formed by covering the copper plate on both sides of the adhesive yellow map with copper plating.

Finally, the circuit board is assembled and tested to obtain a double-sided circuit board.

In the production process, you need to pay attention to the production of conductive layer and etching quality control, as well as adhesive yellow map production and copper plating quality control. All these steps will affect the quality and reliability of the double-sided PCB circuit board. In addition, the production of double-sided circuit board materials also need to meet the needs of the appropriate electronic equipment, such as the quality of the copper plate needs to meet the standard requirements, photosensitive film need to choose the right type and thickness, etc..

In short, double-sided PCB manufacturing process needs to strictly control the quality of each step to ensure that the production of circuit boards with good electrical conductivity and mechanical properties to meet the needs of different electronic devices.