22-layer high-speed communication backplane

Classification：Product Classification
Views：1966
Release time：2023-09-20

Detailed introduction

Layer:22L

Material:TU883

Plate thickness:3.0

Copper thickness:10z

Surface treatment:Immersion gold outer layer line width/spacing:0.075/0.075um

Minimum Hole Diameter:0.25

Soldermask Colour:Green oil with white characters

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About

Ganzhou Tengbo Xin Circuit Co., Ltd. is a high-tech enterprise in Ganzhou City, dedicated to the continuous innovation of science and technology enterprises to provide the best and fastest service.

helpline：

135-3021-8480

Product

>>HDIPCB

>>multidisciplinary PCB

>>High-frequency and high-speed PCB

>>multi-storey PCB

>>specialty PCB

Contacts

Phone：

135-3021-8480

Email:

tbx@tbxpcb.com

Address：

Address: Room 02, 19/F, Gebu Business Building, Hongxing Community, Songgang Town, Bao'an District, Shenzhen, China

News

Technical Support： Songgang Huayi

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Contacts