Communication PCB Backplane

Classification：Product Classification
Views：1921
Release time：2023-09-20

Detailed introduction

Layer:18L

Material:S1000-2M

Plate thickness:3

Copper thickness:70um

Surface Finish:Immersion Gold(Gold:0.05um)

Outer layer line width/spacing:3./3mil

Minimum Hole Diameter:0.25mm

Soldermask Colour:Green oil with white characters

Prev:22-layer high-speed communication backplane

Next:Server PCB

About

Ganzhou Tengbo Xin Circuit Co., Ltd. is a high-tech enterprise in Ganzhou City, dedicated to the continuous innovation of science and technology enterprises to provide the best and fastest service.

helpline：

135-3021-8480

Product

>>HDIPCB

>>multidisciplinary PCB

>>High-frequency and high-speed PCB

>>multi-storey PCB

>>specialty PCB

Contacts

Phone：

135-3021-8480

Email:

tbx@tbxpcb.com

Address：

Address: Room 02, 19/F, Gebu Business Building, Hongxing Community, Songgang Town, Bao'an District, Shenzhen, China

News

Technical Support： Songgang Huayi

Friendly Link：

Contacts